(module "HMC5883L" (layer F.Cu)
  (descr "HMC5883L-1")
  (tags "Integrated Circuit")
  (attr smd)
  (fp_text reference IC** (at -0.225 -0) (layer F.SilkS)
    (effects (font (size 1.27 1.27) (thickness 0.254)))
  )
  (fp_text user %R (at -0.225 -0) (layer F.Fab)
    (effects (font (size 1.27 1.27) (thickness 0.254)))
  )
  (fp_text value "HMC5883L" (at -0.225 -0) (layer F.SilkS) hide
    (effects (font (size 1.27 1.27) (thickness 0.254)))
  )
  (fp_line (start -1.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.2))
  (fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.2))
  (fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.2))
  (fp_line (start -1.5 1.5) (end -1.5 -1.5) (layer F.Fab) (width 0.2))
  (fp_line (start -2.95 -2.5) (end 2.5 -2.5) (layer F.CrtYd) (width 0.1))
  (fp_line (start 2.5 -2.5) (end 2.5 2.5) (layer F.CrtYd) (width 0.1))
  (fp_line (start 2.5 2.5) (end -2.95 2.5) (layer F.CrtYd) (width 0.1))
  (fp_line (start -2.95 2.5) (end -2.95 -2.5) (layer F.CrtYd) (width 0.1))
  (fp_line (start -1.9 -0.8) (end -1.9 -0.8) (layer F.SilkS) (width 0.1))
  (fp_line (start -1.9 -0.7) (end -1.9 -0.7) (layer F.SilkS) (width 0.1))
  (fp_arc (start -1.9 -0.75) (end -1.900 -0.8) (angle -180) (layer F.SilkS) (width 0.1))
  (fp_arc (start -1.9 -0.75) (end -1.900 -0.7) (angle -180) (layer F.SilkS) (width 0.1))
  (pad 1 smd rect (at -1.275 -0.75 90) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -1.275 -0.25 90) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -1.275 0.25 90) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -1.275 0.75 90) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -0.750 1.275 0) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -0.250 1.275 0) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 0.250 1.275 0) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 0.750 1.275 0) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 1.275 0.75 90) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 1.275 0.25 90) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 1.275 -0.25 90) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 1.275 -0.75 90) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 0.750 -1.275 0) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 0.250 -1.275 0) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at -0.250 -1.275 0) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at -0.750 -1.275 0) (size 0.300 0.450) (layers F.Cu F.Paste F.Mask))
  (model HMC5883L.stp
    (at (xyz 0 0 0.035433069927486))
    (scale (xyz 1 1 1))
    (rotate (xyz -180 0 0))
  )
)
